Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
Suitable for CPU, chipsets on Mainboard, VGA card, etc.
Easy to use.
Zif Socket Templates ensure correct applying area with various CPU socket types.
Produces an even layer when using applicator.
Wide range of application temperature.
Specific Gravity: 2.37
Thermal Conductivity: 0.8 watts/meter- °C
Volume Resistivity: 5.0 x 1015
Dielectric Constant: 4.4 at 100k Hz
Dissipation Factor: 0.02 at 100k Hz
Dielectric Strength: 550 volts/mil; 21.7 kV/mm